Wafer Biscuit Baking Oven :
1. Function :
It's a wafer production equipment with electric power or LPG to generate the heat energy for automatic completion of mixture and baking process.
2. Induction :
This is very important equipment in the wafer production line. The wafer baking system uses LPG for heating of the baking plates. The functions of the baking oven is fully automatic from spreading batter on the plates through until baked wafer sheets come out of the oven. Baking is even and produces good quality wafer sheets for next procedure. In PLC there is PID controller which is used for controlling the temperature of the baking plates automatically.
3. Technical Parameter : ·Number of Heating Plates : 15,21,27,33,39,45,51,57,63,69,75and so on .
·Baking Plates Size: 470×325 mm
·Patterns of plates : 2.5×2.5×0.9 3.0×3.0×0.9 differences kinds of shape and patterns
·Output: Up to 6~40sheets/min
·Material : Shell adopts 304 Stainless Steel, Siemens or Mitsubishi to control ,SKF high temperature bearing ,SEW Motor ,Italy Burning Systerms.
·Material of Baking Plates : Gray Cast Iron, Special Steel, Copper.
·Thick of the biscuit: 2.0mm~5.0mm
·Baking Plates temperature adjustable: Normal temperature to 200ºC
·Inside Baking cleaning device
·Dimension : 6000×1620×2200mm
·Power: 4.5 kW
4. Trade Condition :
| Payment Terms |
T/T or L/C |
| Delivery Time |
30 days |
| MOQ |
One set |
| Produciton Capacity |
5 sets/ month |
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