Automatic Wafer Processing Lines
1) Descriptions:
Equipped with Touch Screen and programmed by Siemens, PLC Software, this unit is of electric power or LPG to generate the heat energy to make the wafer biscuit.
The equipment is easy to operate which with automatic temperature control, lighting, making mixer, blowing, sheet splicing to finish the baking process.
(2) Main Technical and Requirements:
Number of Heating Plates: 15, 21, 27, 33, 39, 45, 51, 57, 63, 75 and so on
Baking plates size: 470*325 mm
Patterns of plates; 2.5*. 2.5*0.9mm / 3.0*3.0*0.9mm differences kinds of shape and patterns
OutputUp: To 6 ~ 40 sheets/min
MaterialShell: Adopts 304 Stainless Steel, Siemens or Mitsubishi to control, SKF high temperature bearing, SEW motor, Italy burning systems.
Material of baking platesGray cast iron, special steel, copper
Thickness of the biscuit2.0mm~5.0mm
Baking plates temperature adjustableNormal temperature to 200° C
Dimension: 9500*1620*2200mm
Power: 4.5KW
Inside functionInside baking cleaning device
Perfect after-sales service
1. One year guarantee
2. When the machine is arrived in the client's place we will send the technical staff to install the machine for the client.
3. We will help the client solve the machine problem anytime the clients when there is something wrong with the machine in the future.
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