Smashing Machine for Wafer Production Line

• Customization: Available
• Crushing Degree: Intermediate Crusher
• Crushing Style: Grinding and Impact
• Model NO.: WSD5100FS
• Cutter Material: High-Speed Steel
• Drive: Electric
• Object: Smashing
• Type: Wafer Wastage Smashing
• Material: Stainless Steel
• Size: 900 X 700 X 1000 Mm
• Compressive Strength (For Crushing): >300MPA
• Finished Surface: Outer Surface Process
• Tongs′ Features: Adjustable Tongs
• Transport Package: Wooden Case / Film
• Specification: 0.9mx0.7mx0.9m
• Trademark: WSD
• Origin: Zhaoqing City, Guangdong Province, China
• HS Code: 8438100010
• Production Capacity: 15~18pieces

Product Description

Smashing Machine

1. Function
1. Smashing machine is used for collectioon of wafer bits from the cutting machine.
2. In the wafer line there is wastage from the cutting process which needs to be reused in order to minimize the overall wastage of wafer baking system which is about 2%.
3. This equipment is used to grind the discarded wafer in to reusable form. The ground material can be used with cream as additive depending on the requirement.
4. The smashing or grinding machine is constructed out of stainless steel material to maintain hygiene of reusable product. The grinding system is driven by 3kW motor to have high power and efficiency.

2. Trade Condition

Payment Terms	T/Tor L/C
Delivery Time	20 days
Loading Port	FOB Zhaoqing Port
MOQ	1 SET