Wafer Biscuit Cutting Machine (WSD27-WSD69Q)

• Customization: Available
• Certification: CE
• Application: Wafer Biscuit Cutting
• Model NO.: WSD27-WSD69
• Type: Biscuit Cutting
• Type for Cutting Machine: Blade Cutting
• Automation: Automatic
• Condition: New
• Transport Package: Wooden Case / Film
• Specification: 1.68mx1.6mx0.8m
• Trademark: WSD
• Origin: Zhaoqing City, Guangdong Province, China
• HS Code: 8438100010
• Production Capacity: 15~18pieces

Product Description

Wafer Biscuit Cutting Machine
1. Function:
1). The cutting machine is used for cutting the cream-spread and laminated wafer into required size.
2). The machine is equipped with to-and-fro conveying belt and it can cut the wafer block to all sizes.
3). It is the wire or blade cut machine to cut the cream filled wafer sheets depending on the final size required.
4). The cutting size can be continently adjustable.
5). This machine is preumatcially handled so that the smooth transfer through the machine is ensured.
6). The direction changing to have longitudinal and cross will be done automatically.

2. Technical Parameter: 
·Cutting Method: Blade or Steel Wire type
·Cutting Capacity: 25pieces/min
·Dimension: 2400×2100×1000mm
·Power: 0.55kW


3. Trade Condition

Payment Terms	T/T or L/C
Loading Port	FOB Zhaoqing Port
Delivery Time	30 days
Production Capacity	5 sets / month