CE Proved Wafer Cut-off Machine

Product Details
Customization: Available
Transport Package: Wooden Case / Film
Specification: 1.68mx1.6mx0.8m
Gold Member Since 2010

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Basic Info.

Model NO.
WSD2700Q
Trademark
WSD
Origin
Zhaoqing City, Guangdong Province, China
HS Code
8438230
Production Capacity
15~18pieces

Product Description

Cutting Machine
1. Function:
1). The cutting machine is used for cutting the cream-spread and laminated wafer into required size.
2). The machine is equipped with to-and-fro conveying belt and it can cut the wafer block to all sizes.
3). It is the wire or blade cut machine to cut the cream filled wafer sheets depending on the final size required.
4). The cutting size can be continently adjustable.
5). This machine is preumatcially handled so that the smooth transfer through the machine is ensured.
6). The direction changing to have longitudinal and cross will be done automatically.

1. Materials: The machine frame is made of steel with international standard and the cover adopts imported stainless steel plate.

2. Trade Condition
Main Technical Parameter: Models27~63
Payment Terms: T/T
Delivery Time: 30 days
Loading Port: FOBZhaoqing Port
MQO(minmum order quantity):
One set

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